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1

Mechanical reliability of solder joints in PCBs assembled in surface mount technology

Agata Skwarek, Dr, Borecki, Janusz, Serzysko, Tomasz

Journal:

Soldering & Surface Mount Technology

Année:

2016

Langue:

english

Fichier:

PDF, 517 KB

english, 2016

2

Problems of PCB microvias filling by conductive paste

Ryszard Kisiel, Jan Felba, Janusz Borecki, Andrzej Moscicki

Journal:

Microelectronics Reliability

Année:

2007

Langue:

english

Fichier:

PDF, 586 KB

english, 2007

3

The dependence of reliability and mechanical strength of the solder joints in 3D PoP structures from sizes of solder powders applied in soldering materials

Sitek, Janusz, Koscielski, Marek, Borecki, Janusz, Serzysko, Tomasz

Journal:

Soldering & Surface Mount Technology

Année:

2017

Langue:

english

Fichier:

PDF, 261 KB

english, 2017

4

Conductive adhesives for through holes and blind vias metallization

Ryszard Kisiel, Janusz Borecki, Grażyna Kozioł, Jan Felba

Journal:

Microelectronics Reliability

Année:

2005

Langue:

english

Fichier:

PDF, 239 KB

english, 2005

5

[IEEE 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - London, UK (2007.04.16-2007.04.18)] 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 - Numerical Modeling of Electrical Resistance of Interconnections in High-Tech Multilayer PCBs Manufactured by Magnetron Sputtering Deposition of Copper

Borecki, Janusz, Wymyslowski, Artur

Année:

2007

Langue:

english

Fichier:

PDF, 5.38 MB

english, 2007

6

[IEEE 2012 IEEE 12th International Conference on Nanotechnology (IEEE-NANO) - Birmingham, United Kingdom (2012.08.20-2012.08.23)] 2012 12th IEEE International Conference on Nanotechnology (IEEE-NANO) - Interconnection process by ink jet printing method

Moscicki, Andrzej, Falat, Tomasz, Smolarek, Anita, Kinart, Andrzej, Felba, Jan, Borecki, Janusz

Année:

2012

Langue:

english

Fichier:

PDF, 1.64 MB

english, 2012

7

SPIE Proceedings [SPIE Electron Technology Conference 2013 - Ryn, Poland (Tuesday 16 April 2013)] Electron Technology Conference 2013 - Selected properties of multi-terminal resistors embedded in printed circuit boards

Kłossowicz, Adam, Kukuła, Radosław, Winiarski, Paweł, Dziedzic, Andrzej, Stęplewski, Wojciech, Borecki, Janusz, Szczepanski, Pawel, Kisiel, Ryszard, Romaniuk, Ryszard S.

Année:

2013

Langue:

english

Fichier:

PDF, 705 KB

english, 2013

8

Wykorzystanie znieczulenia podtlenkiem azotu na oddziale dziecięcym szpitala rejonowego

Rataj, Janusz, Rataj, Agata, Borecki, Piotr

Journal:

Pediatria Polska

Année:

2007

Langue:

polish

Fichier:

PDF, 229 KB

polish, 2007

9

[IEEE 2011 IEEE 11th International Conference on Nanotechnology (IEEE-NANO) - Portland, OR, USA (2011.08.15-2011.08.18)] 2011 11th IEEE International Conference on Nanotechnology - Nano-silver inkjet printed interconnections through the microvias for flexible electronics

Falat, Tomasz, Felba, Jan, Moscicki, Andrzej, Borecki, Janusz

Année:

2011

Langue:

english

Fichier:

PDF, 2.26 MB

english, 2011

10

[IEEE 2006 29th International Spring Seminar on Electronics Technology - St. Marienthal, Germany (2006.05.10-2006.05.14)] 2006 29th International Spring Seminar on Electronics Technology - Quality of PCB Interconnections Based on Blind Microvias Metallized by Magnetron Sputtering Deposition

Borecki, Janusz, Felba, Jan, Posadowski, Witold M.

Année:

2006

Langue:

english

Fichier:

PDF, 1.36 MB

english, 2006

11

[IEEE 2008 31st International Spring Seminar on Electronics Technology (ISSE) - Budapest, Hungary (2008.05.7-2008.05.11)] 2008 31st International Spring Seminar on Electronics Technology - Assessment of lead-free solder pastes with different type of powder for fine-pitch application

Arazna, Aneta, Koziol, Grazyna, Steplewski, Wojciech, Borecki, Janusz

Année:

2008

Langue:

english

Fichier:

PDF, 778 KB

english, 2008

12

Thermal effects in embedded thin- and thick-film resistors in comparison to chip resistors

Agata Skwarek, Dr, Steplewski, Wojciech, Dziedzic, Andrzej, Borecki, Janusz, Koziol, Grazyna, Serzysko, Tomasz

Journal:

Année:

2014

Langue:

english

Fichier:

PDF, 300 KB

english, 2014

13

Environmental tests of embedded thin- and thick-film resistors in comparison to chip resistors

Agata Skwarek, Dr, Steplewski, Wojciech, Dziedzic, Andrzej, Borecki, Janusz, Koziol, Grazyna, Serzysko, Tomasz

Journal:

Année:

2014

Langue:

english

Fichier:

PDF, 196 KB

english, 2014

14

Reactance components embedded in printed circuit boards

Agata Skwarek, Dr, Stęplewski, Wojciech, Dziedzic, Andrzej, Kłossowicz, Adam, Winiarski, Paweł, Borecki, Janusz, Kozioł, Grażyna, Serzysko, Tomasz

Journal:

Année:

2015

Langue:

english

Fichier:

PDF, 321 KB

english, 2015

15

[IEEE 2006 1st Electronic Systemintegration Technology Conference - Dresden, Germany (2006.09.5-2006.09.7)] 2006 1st Electronic Systemintegration Technology Conference - Interconnections in Multilayer PCBs Based on Microvias Metallized by Magnetron Sputtering Deposition

Borecki, Janusz, Felba, Jan, Gromek, Jozef, Posadowski, Witold

Année:

2006

Langue:

english

Fichier:

PDF, 7.44 MB

english, 2006

16

SPIE Proceedings [SPIE Electron Technology Conference 2013 - Ryn, Poland (Tuesday 16 April 2013)] Electron Technology Conference 2013 - AC properties of low-pass RC filters embedded in printed circuit boards

Winiarski, Paweł, Kłossowicz, Adam, Stęplewski, Wojciech, Borecki, Janusz, Nitsch, Karol, Dziedzic, Andrzej, Szczepanski, Pawel, Kisiel, Ryszard, Romaniuk, Ryszard S.

Année:

2013

Langue:

english

Fichier:

PDF, 656 KB

english, 2013

17

SPIE Proceedings [SPIE SPIE Proceedings - (Sunday 12 February 2012)] - High density interconnections in PCBs - an overview of plating techniques

Borecki, Janusz, Romaniuk, Ryszard S.

Année:

2012

Langue:

english

Fichier:

PDF, 794 KB

english, 2012

18

Application of direct bonded copper substrates for prototyping of power electronic modules

Grzesiak, Wojciech, Maćków, Piotr, Maj, Tomasz, Synkiewicz, Beata, Witek, Krzysztof, Kisiel, Ryszard, Myśliwiec, Marcin, Borecki, Janusz, Serzysko, Tomasz, Żupnik, Marek

Journal:

Année:

2016

Langue:

english

Fichier:

PDF, 822 KB

english, 2016

19

SPIE Proceedings [SPIE SPIE Proceedings - (Sunday 12 February 2012)] - Applying thin layer resistors in multilayer printed circuit boards

Borecki, Janusz, Romaniuk, Ryszard S.

Année:

2012

Langue:

english

Fichier:

PDF, 412 KB

english, 2012

20

Assessment of stability and reliability of embedded components in printed circuit boards

Steplewski, Wojciech, Dziedzic, Andrzej, Borecki, Janusz, Serzysko, Tomasz

Journal:

Année:

2017

Langue:

english

Fichier:

PDF, 569 KB

english, 2017

21

Thermal stability analysis of passive components embedded into printed circuit boards

Stęplewski, Wojciech, Dziedzic, Andrzej, Janeczek, Kamil, Araźna, Aneta, Lipiec, Krzysztof, Borecki, Janusz, Serzysko, Tomasz

Journal:

Année:

2018

Langue:

english

Fichier:

PDF, 455 KB

english, 2018

22

Piezoresistive effect in embedded thick-film resistors

Borecki, Janusz, AraÅºna, Aneta, Janeczek, Kamil, Kalenik, Jerzy, Kalenik, MichaÅ, StÄplewski, Wojciech, Tarakowski, RafaÅ

Journal:

Année:

2019

Fichier:

PDF, 1.60 MB

2019